PRODUCTS

SPI NOR FlashMemory

SPI NOR Flash 产品图

SPI NOR FLASH

技术领先的非易失性存储器产品

紫光青藤是技术领先的非易失性存储器产品供应商,承续于传统嵌入式闪存领域的人才与经验积累,依赖于持续的技术进步与品质保证,向客户提供高可靠性、低功耗和高性价比的存储器产品。

产品应用领域广阔,对消费级、工业级的应用需求,均可提供相应规格产品和技术支持。

PACKAGED DEVICES

封装品Packaged

NOR Flash闪存是非易失性存储器,可以对存储器单元块进行擦写和再编程,应用程序可以直接在Flash闪存内运行。紫光青藤NOR Flash芯片具有芯片尺寸小、擦写速度快、功耗低、支持超高温下高可靠工作的特点。

1.65V~3.6V 宽压 SPI NOR Flash

Part No.StorageVoltageInterfaceFrequencyTemperatureI/O BusStatus
TH25Q-40UA4Mbit1.65~3.6VSPI85MHz/104MHz-40℃~85℃Single/Dual/QuadMass production
TH25Q-80UA8Mbit1.65~3.6VSPI85MHz/104MHz-40℃~85℃Single/Dual/QuadMass production
TH25D-20UA2Mbit1.65~3.6VSPI85MHz/100MHz-40℃~85℃Single/DualMass production
TH25D-40UA4Mbit1.65~3.6VSPI85MHz/100MHz-40℃~85℃Single/DualMass production
TH25Q-16UA16Mbit1.65~3.6VSPI80MHz/85MHz-40℃~85℃Single/Dual/QuadMass production
TH25Q-16UB16Mbit1.65~3.6VSPI60MHz/90MHz/104MHz-40℃~85℃Single/Dual/QuadSampling
TH25Q-16UB16Mbit1.65~3.6VSPI60MHz/90MHz/104MHz-40℃~105℃Single/Dual/QuadSampling
TH25D-40UB4Mbit1.65~3.6VSPI60MHz/90MHz/104MHz-40℃~85℃Single/DualSampling
TH25D-40UB4Mbit1.65~3.6VSPI60MHz/90MHz/104MHz-40℃~105℃Single/DualSampling

封装形式:Die / SOP8 150mil / SOP8 208mil / USON8 3*2mm / TSSOP8 173mil(各型号封装以规格书为准)

1.65~2.0V 低压 SPI NOR Flash

Part No.StorageVoltageInterfaceFrequencyTemperatureI/O BusStatus
TH25Q-40LA4Mbit1.65~2.0VSPI85Mhz-40℃~85℃Single/Dual/QuadMass production
TH25D-20LA2Mbit1.65~2.0VSPI85Mhz-40℃~85℃Single/DualMass production
TH25D-40LA4Mbit1.65~2.0VSPI85Mhz-40℃~85℃Single/DualMass production
TH25Q-80LA8Mbit1.65~2.0VSPI85Mhz-40℃~85℃Single/Dual/QuadMass production
TH25D-40LB4Mbit1.65~2.0VSPI60Mhz-40℃~85℃Single/DualSampling
TH25D-40LB4Mbit1.65~2.0VSPI60Mhz-40℃~105℃Single/DualSampling

封装形式:Die / SOP8 150mil / SOP8 208mil / USON8 3*2mm / TSSOP8 173mil(各型号封装以规格书为准)

2.3V~3.6V 高压 SPI NOR Flash

Part No.StorageVoltageInterfaceFrequencyTemperatureI/O BusStatus
TH25Q-40HA4Mbit2.3~3.6VSPI104Mhz-40℃~85℃Single/Dual/QuadMass production
TH25Q-80HA8Mbit2.3~3.6VSPI104Mhz-40℃~85℃Single/Dual/QuadMass production
TH25D-20HA2Mbit2.3~3.6VSPI100Mhz-40℃~85℃Single/DualMass production
TH25D-40HA4Mbit2.3~3.6VSPI100Mhz-40℃~85℃Single/DualMass production
TH25Q-16HB16Mbit2.3~3.6VSPI104Mhz-40℃~85℃Single/DualMass production
TH25Q-16HB16Mbit2.3~3.6VSPI104Mhz-40℃~105℃Single/Dual/QuadMass production
TH25Q-80HB8Mbit2.3~3.6VSPI104Mhz-40℃~85℃Single/Dual/QuadMass production
TH25Q-80HB8Mbit2.3~3.6VSPI104Mhz-40℃~105℃Single/Dual/QuadMass production
TH25D-40HB4Mbit2.3~3.6VSPI104Mhz-40℃~85℃Single/DualMass production
TH25D-40HB4Mbit2.3~3.6VSPI104Mhz-40℃~105℃Single/DualMass production

封装形式:Die / SOP8 150mil / SOP8 208mil / USON8 3*2mm / TSSOP8 173mil(各型号封装以规格书为准)

晶圆裸片(Wafer/KGD)

WAFER / KGD

晶圆裸片

未减薄划片的圆片可以直接提供客户,根据MAP图确定的Flash良品芯片(KGD),可以和客户的主芯片进行系统合封(SIP)。

晶圆裸片提供宽压、低压、高压全系列型号(TH25Q/TH25D 系列),封装形式为 KGD,支持系统级封装(SIP)集成。

申请样品

需要完整规格书?

在下载专区获取 TH25 系列全部数据手册

下载专区